Amkor Technology, Inc. NMS · AMKR

Compare AMKR vs peers

Line AMKR up against up to 4 peers (5 tickers total) across ~30 metrics and get one weighted 0-100 verdict — best in green, worst in red. Peers also overlay on the chart above as rebased % lines, or flip the chart to the 2×2 grid for side-by-side mini charts.

Earnings replay · last 20 reports

How this stock actually behaves on report day: each past earnings print with the beat-or-miss and the next-day move — a track record for handicapping the next one.

Earnings markers are overlaid on the daily price chart above. Click a ▲ marker for that day's move.

Peer comparison · Technology

Context check: the same key numbers for the closest Technology names side by side, so you can tell whether this stock is the standout or just moving with its group.

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Ownership

Who holds the stock and what they've been doing lately — big funds on the left, executives' own buys and sells on the right. Insider buying is the rarer, louder signal.

What Wall Street expects next: the consensus forecasts for the coming quarters. The market usually reacts to results versus these numbers, not the raw results themselves.

The company's own paperwork, straight from the regulator — annual and quarterly reports, big announcements and insider trades. The primary source behind every headline.

About AMKR

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and subs…