Price chart
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Financial overlay · last 12 quarters
| Quarter | Revenue | Net income | Op income | FCF | Net margin | Op margin |
|---|---|---|---|---|---|---|
| 2026-03-31 | $5.8B | $1.8B | $2.0B | $0.8B | 31.2% | 35.0% |
| 2025-12-31 | $5.3B | $1.6B | $1.8B | $1.2B | 29.8% | 33.9% |
| 2025-09-30 | $5.3B | $1.6B | $1.8B | $1.6B | 29.5% | 34.4% |
| 2025-06-30 | $5.2B | $1.7B | $1.7B | $2.4B | 33.3% | 33.7% |
| 2025-03-31 | $4.7B | $1.3B | $1.6B | $1.0B | 28.2% | 33.1% |
| 2024-12-31 | $nanB | $nanB | $nanB | $nanB | nan% | nan% |
| 2024-09-30 | $nanB | $nanB | $nanB | $nanB | nan% | nan% |
Earnings replay · last 20 reports
| Date | EPS actual | EPS est | Surprise |
|---|---|---|---|
| 2026-04-22 | 1.47 | 1.36 | +7.9% |
| 2026-01-28 | 1.27 | 1.17 | +8.7% |
| 2025-10-22 | 1.26 | 1.22 | +3.3% |
| 2025-07-30 | 1.33 | 1.21 | +10.4% |
| 2025-04-23 | 1.04 | 1.00 | +4.1% |
| 2025-01-29 | 0.92 | 0.87 | +5.6% |
| 2024-10-23 | 0.86 | 0.81 | +6.5% |
| 2024-07-31 | 0.81 | 0.76 | +7.3% |
| 2024-04-24 | 0.78 | 0.73 | +6.8% |
| 2024-01-24 | 0.75 | 0.71 | +5.7% |
| 2023-10-18 | 0.69 | 0.61 | +11.8% |
| 2023-07-26 | 0.60 | 0.51 | +16.5% |
| 2023-04-19 | 0.70 | 0.65 | +7.1% |
| 2023-01-25 | 1.07 | 1.00 | +7.1% |
| 2022-10-19 | 1.04 | 0.95 | +9.2% |
| 2022-07-27 | 0.88 | 0.73 | +20.4% |
| 2022-04-20 | 0.74 | 0.75 | -1.4% |
| 2022-01-26 | 0.85 | 0.85 | +0.2% |
| 2021-10-20 | 0.84 | 0.82 | +1.9% |
| 2021-07-28 | 0.81 | 0.76 | +6.3% |
Earnings markers are overlaid on the price chart above. Transcript summaries require PERPLEXITY_API_KEY (deferred to a follow-up).
Peer comparison · Technology
| Ticker ⇅ | Mkt cap ⇅ | P/E ⇅ | Fwd P/E ⇅ | P/S ⇅ | EV/EBITDA ⇅ | P/B ⇅ | Gross M ⇅ | Rev gr ⇅ | EPS gr ⇅ | FCF yld ⇅ |
|---|---|---|---|---|---|---|---|---|---|---|
| LRCX ★ | $418B | 63.1 | 42.1 | 19.3 | 53.2 | 39.5 | 50.0% | 23.8% | 40.8% | 1.04% |
| AAPL | $4,629B | 38.1 | 32.8 | 10.3 | 29.0 | 43.4 | 47.9% | 16.6% | 21.8% | 2.18% |
| MSFT | $3,278B | 26.3 | 22.8 | 10.3 | 18.0 | 7.9 | 68.3% | 18.3% | 23.4% | 1.13% |
| NVDA | $5,397B | 34.1 | 17.6 | 21.3 | 32.3 | 34.4 | 74.1% | 85.2% | 214.5% | 0.86% |
| GOOGL | $4,384B | 27.6 | 25.0 | 10.4 | 27.0 | 9.2 | 60.4% | 21.8% | 82.0% | 0.64% |
| META | $1,517B | 21.7 | 16.5 | 7.1 | 13.9 | 6.2 | 81.9% | 33.1% | 62.4% | 1.68% |
| AVGO | $2,280B | 93.5 | 26.0 | 33.4 | 62.7 | 28.6 | 76.7% | 29.5% | 31.6% | 1.12% |
| ORCL | $703B | 44.0 | 30.4 | 11.0 | 30.3 | 21.0 | 67.1% | 21.7% | 24.5% | -3.17% |
Auto-seeded from sector. Click any ticker to switch.
Ownership
Top institutional holders
Top-10 concentration: 38.03%
| Holder | Shares | % out |
|---|---|---|
| Blackrock Inc. | 132,852,320 | 10.62% |
| Vanguard Capital Management LLC | 81,155,744 | 6.49% |
| State Street Corporation | 59,158,300 | 4.73% |
| Vanguard Portfolio Management LLC | 37,060,963 | 2.96% |
| Geode Capital Management, LLC | 35,175,926 | 2.81% |
| FMR, LLC | 33,574,842 | 2.68% |
| JPMORGAN CHASE & CO | 32,712,933 | 2.62% |
| Invesco Ltd. | 24,255,563 | 1.94% |
| Ameriprise Financial, Inc. | 20,788,130 | 1.66% |
| Morgan Stanley | 18,971,122 | 1.52% |
Insider activity · 90d
No insider trades for LRCX in last 90d.
Analyst estimates
yfinanceConsensus: buy (mean 1.52778). Distribution requires FINNHUB_API_KEY.
SEC filings
| Form | Filed | Description | Action |
|---|---|---|---|
| 4 | 2026-06-02 | FORM 4 | view · |
| 4 | 2026-05-04 | FORM 4 | view · |
| 4 | 2026-04-28 | FORM 4 | view · |
| 10-Q | 2026-04-23 | 10-Q | view · |
| 8-K | 2026-04-22 | 8-K | view · |
| 4 | 2026-03-11 | FORM 4 | view · |
| 4 | 2026-03-05 | FORM 4 | view · |
| 4 | 2026-03-05 | FORM 4 | view · |
| 4 | 2026-03-03 | FORM 4 | view · |
| 4 | 2026-03-03 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-03-02 | FORM 4 | view · |
| 4 | 2026-02-25 | FORM 4 | view · |
| 4 | 2026-02-09 | FORM 4 | view · |
| 4 | 2026-02-09 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 4 | 2026-02-05 | FORM 4 | view · |
| 8-K | 2026-02-03 | 8-K | view · |
| 10-Q | 2026-01-29 | 10-Q | view · |
| 8-K | 2026-01-28 | 8-K | view · |
| 4 | 2025-12-18 | FORM 4 | view · |
| 4 | 2025-11-17 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 4 | 2025-11-10 | FORM 4 | view · |
| 8-K | 2025-11-06 | 8-K | view · |
| 4 | 2025-11-04 | FORM 4 | view · |
| 4 | 2025-11-03 | FORM 4 | view · |
| 4 | 2025-10-28 | FORM 4 | view · |
| 10-Q | 2025-10-24 | 10-Q | view · |
| 8-K | 2025-10-22 | 8-K | view · |
| 4 | 2025-10-14 | FORM 4 | view · |
| DEF 14A | 2025-09-24 | DEF 14A | view · |
| 8-K | 2025-09-11 | 8-K | view · |
| 10-K | 2025-08-11 | 10-K | view · |
| 4 | 2025-08-06 | FORM 4 | view · |
| 8-K | 2025-07-30 | 8-K | view · |
| 8-K | 2025-05-21 | 8-K | view · |
| 10-Q | 2025-04-25 | 10-Q | view · |
| 8-K | 2025-04-23 | 8-K | view · |
| 4 | 2025-03-04 | FORM 4 | view · |
| 4 | 2025-03-04 | FORM 4 | view · |
About
Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits in the United States, China, Korea, Taiwan, Japan, Southeast Asia, and Europe. The company offers ALTUS systems to deposit conformal or selective films for tungsten or molybdenum metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SPEED gapfill high-density plasma chemical vapor deposition (CVD) products; Striker single-wafer atomic layer deposition products for dielectric film solutions; and VECTOR plasma-enhanced CVD products. It also provides Flex for dielectric etch applications; Vantex, a dielectric etch system that provides RF technology and repeatable wafer-to-wafer performance enabled by Equipment Intelligence solutions; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. In addition, the company offers Coronus bevel clean products to enhance die yield; and Da Vinci, DV-Prime, EOS, and SP series products to address various wafer …